Semiconductor Market Report by Components (Memory Devices, Logic Devices, Analog IC, MPU, Discrete Power Devices, MCU, Sensors, and Others), Material Used (Silicon Carbide, Gallium Manganese Arsenide, Copper Indium Gallium Selenide, Molybdenum Disulfide, and Others), End User (Automotive, Industrial, Data Centre, Telecommunication, Consumer Electronics, Aerospace and Defense, Healthcare, and Others), and Region 2025-2033

Semiconductor Market Report by Components (Memory Devices, Logic Devices, Analog IC, MPU, Discrete Power Devices, MCU, Sensors, and Others), Material Used (Silicon Carbide, Gallium Manganese Arsenide, Copper Indium Gallium Selenide, Molybdenum Disulfide, and Others), End User (Automotive, Industrial, Data Centre, Telecommunication, Consumer Electronics, Aerospace and Defense, Healthcare, and Others), and Region 2025-2033

Report Format: PDF+Excel | Report ID: SR112025A7701

1 Preface

2 Scope and Methodology
2.1 Objectives of the Study
2.2 Stakeholders
2.3 Data Sources
2.3.1 Primary Sources
2.3.2 Secondary Sources
2.4 Market Estimation
2.4.1 Bottom-Up Approach
2.4.2 Top-Down Approach
2.5 Forecasting Methodology

3 Executive Summary

4 Global Semiconductor Market - Introduction
4.1 Overview
4.2 Market Dynamics
4.3 Industry Trends
4.4 Competitive Intelligence

5 Global Semiconductor Market Landscape
5.1 Historical and Current Market Trends (2019-2024)
5.2 Market Forecast (2025-2033)

6 Global Semiconductor Market - Breakup by Components
6.1 Memory Devices

6.1.1 Overview
6.1.2 Historical and Current Market Trends (2019-2024)
6.1.3 Market Segmentation
6.1.4 Market Forecast (2025-2033)
6.2 Logic Devices
6.2.1 Overview
6.2.2 Historical and Current Market Trends (2019-2024)
6.2.3 Market Segmentation
6.2.4 Market Forecast (2025-2033)
6.3 Analog IC
6.3.1 Overview
6.3.2 Historical and Current Market Trends (2019-2024)
6.3.3 Market Segmentation
6.3.4 Market Forecast (2025-2033)
6.4 MPU
6.4.1 Overview
6.4.2 Historical and Current Market Trends (2019-2024)
6.4.3 Market Segmentation
6.4.4 Market Forecast (2025-2033)
6.5 Discrete Power Devices
6.5.1 Overview
6.5.2 Historical and Current Market Trends (2019-2024)
6.5.3 Market Segmentation
6.5.4 Market Forecast (2025-2033)
6.6 MCU
6.6.1 Overview
6.6.2 Historical and Current Market Trends (2019-2024)
6.6.3 Market Segmentation
6.6.4 Market Forecast (2025-2033)
6.7 Sensors
6.7.1 Overview
6.7.2 Historical and Current Market Trends (2019-2024)
6.7.3 Market Segmentation
6.7.4 Market Forecast (2025-2033)
6.8 Others
6.8.1 Historical and Current Market Trends (2019-2024)
6.8.2 Market Forecast (2025-2033)
6.9 Attractive Investment Proposition by Components

7 Global Semiconductor Market - Breakup by Material Used
7.1 Silicon Carbide

7.1.1 Overview
7.1.2 Historical and Current Market Trends (2019-2024)
7.1.3 Market Segmentation
7.1.4 Market Forecast (2025-2033)
7.2 Gallium Manganese Arsenide
7.2.1 Overview
7.2.2 Historical and Current Market Trends (2019-2024)
7.2.3 Market Segmentation
7.2.4 Market Forecast (2025-2033)
7.3 Copper Indium Gallium Selenide
7.3.1 Overview
7.3.2 Historical and Current Market Trends (2019-2024)
7.3.3 Market Segmentation
7.3.4 Market Forecast (2025-2033)
7.4 Molybdenum Disulfide
7.4.1 Overview
7.4.2 Historical and Current Market Trends (2019-2024)
7.4.3 Market Segmentation
7.4.4 Market Forecast (2025-2033)
7.5 Others
7.5.1 Historical and Current Market Trends (2019-2024)
7.5.2 Market Forecast (2025-2033)
7.6 Attractive Investment Proposition by Material Used

8 Global Semiconductor Market - Breakup by End User
8.1 Automotive

8.1.1 Overview
8.1.2 Historical and Current Market Trends (2019-2024)
8.1.3 Market Segmentation
8.1.4 Market Forecast (2025-2033)
8.2 Industrial
8.2.1 Overview
8.2.2 Historical and Current Market Trends (2019-2024)
8.2.3 Market Segmentation
8.2.4 Market Forecast (2025-2033)
8.3 Data Centre
8.3.1 Overview
8.3.2 Historical and Current Market Trends (2019-2024)
8.3.3 Market Segmentation
8.3.4 Market Forecast (2025-2033)
8.4 Telecommunication
8.4.1 Overview
8.4.2 Historical and Current Market Trends (2019-2024)
8.4.3 Market Segmentation
8.4.4 Market Forecast (2025-2033)
8.5 Consumer Electronics
8.5.1 Overview
8.5.2 Historical and Current Market Trends (2019-2024)
8.5.3 Market Segmentation
8.5.4 Market Forecast (2025-2033)
8.6 Aerospace and Defense
8.6.1 Overview
8.6.2 Historical and Current Market Trends (2019-2024)
8.6.3 Market Segmentation
8.6.4 Market Forecast (2025-2033)
8.7 Healthcare
8.7.1 Overview
8.7.2 Historical and Current Market Trends (2019-2024)
8.7.3 Market Segmentation
8.7.4 Market Forecast (2025-2033)
8.8 Others
8.8.1 Historical and Current Market Trends (2019-2024)
8.8.2 Market Forecast (2025-2033)
8.9 Attractive Investment Proposition by End User

9 Global Semiconductor Market – Breakup by Region
9.1 North America
9.1.1 United States

9.1.1.1 Market Drivers
9.1.1.2 Historical and Current Market Trends (2019-2024)
9.1.1.3 Market Breakup by Components
9.1.1.4 Market Breakup by Material Used
9.1.1.5 Market Breakup by End User
9.1.1.6 Key Players
9.1.1.7 Market Forecast (2025-2033)
9.1.2 Canada
9.1.2.1 Market Drivers
9.1.2.2 Historical and Current Market Trends (2019-2024)
9.1.2.3 Market Breakup by Components
9.1.2.4 Market Breakup by Material Used 
9.1.2.5 Market Breakup by End User
9.1.2.6 Key Players
9.1.2.7 Market Forecast (2025-2033)
9.2 Europe
9.2.1 Germany
9.2.1.1 Market Drivers
9.2.1.2 Historical and Current Market Trends (2019-2024)
9.2.1.3 Market Breakup by Components
9.2.1.4 Market Breakup by Material Used 
9.2.1.5 Market Breakup by End User
9.2.1.6 Key Players
9.2.1.7 Market Forecast (2025-2033)
9.2.2 France
9.2.2.1 Market Drivers
9.2.2.2 Historical and Current Market Trends (2019-2024)
9.2.2.3 Market Breakup by Components
9.2.2.4 Market Breakup by Material Used 
9.2.2.5 Market Breakup by End User
9.2.2.6 Key Players
9.2.2.7 Market Forecast (2025-2033)
9.2.3 United Kingdom
9.2.3.1 Market Drivers
9.2.3.2 Historical and Current Market Trends (2019-2024)
9.2.3.3 Market Breakup by Components
9.2.3.4 Market Breakup by Material Used 
9.2.3.5 Market Breakup by End User
9.2.3.6 Key Players
9.2.3.7 Market Forecast (2025-2033)
9.2.4 Italy
9.2.4.1 Market Drivers
9.2.4.2 Historical and Current Market Trends (2019-2024)
9.2.4.3 Market Breakup by Components
9.2.4.4 Market Breakup by Material Used 
9.2.4.5 Market Breakup by End User
9.2.4.6 Key Players
9.2.4.7 Market Forecast (2025-2033)
9.2.5 Spain
9.2.5.1 Market Drivers
9.2.5.2 Historical and Current Market Trends (2019-2024)
9.2.5.3 Market Breakup by Components
9.2.5.4 Market Breakup by Material Used  
9.2.5.5 Market Breakup by End User
9.2.5.6 Key Players
9.2.5.7 Market Forecast (2025-2033)
9.2.6 Others
9.2.6.1 Historical and Current Market Trends (2019-2024)
9.2.6.2 Market Forecast (2025-2033)
9.3 Asia Pacific
9.3.1 China
9.3.1.1 Market Drivers
9.3.1.2 Historical and Current Market Trends (2019-2024)
9.3.1.3 Market Breakup by Components
9.3.1.4 Market Breakup by Material Used 
9.3.1.5 Market Breakup by End User
9.3.1.6 Key Players
9.3.1.7 Market Forecast (2025-2033)
9.3.2 Japan
9.3.2.1 Market Drivers
9.3.2.2 Historical and Current Market Trends (2019-2024)
9.3.2.3 Market Breakup by Components
9.3.2.4 Market Breakup by Material Used 
9.3.2.5 Market Breakup by End User
9.3.2.6 Key Players
9.3.2.7 Market Forecast (2025-2033)
9.3.3 India
9.3.3.1 Market Drivers
9.3.3.2 Historical and Current Market Trends (2019-2024)
9.3.3.3 Market Breakup by Components
9.3.3.4 Market Breakup by Material Used 
9.3.3.5 Market Breakup by End User 
9.3.3.6 Key Players
9.3.3.7 Market Forecast (2025-2033)
9.3.4 South Korea
9.3.4.1 Market Drivers
9.3.4.2 Historical and Current Market Trends (2019-2024)
9.3.4.3 Market Breakup by Components
9.3.4.4 Market Breakup by Material Used 
9.3.4.5 Market Breakup by End User
9.3.4.6 Key Players
9.3.4.7 Market Forecast (2025-2033)
9.3.5 Australia
9.3.5.1 Market Drivers
9.3.5.2 Historical and Current Market Trends (2019-2024)
9.3.5.3 Market Breakup by Components
9.3.5.4 Market Breakup by Material Used  
9.3.5.5 Market Breakup by End User
9.3.5.6 Key Players
9.3.5.7 Market Forecast (2025-2033)
9.3.6 Indonesia
9.3.6.1 Market Drivers
9.3.6.2 Historical and Current Market Trends (2019-2024)
9.3.6.3 Market Breakup by Components
9.3.6.4 Market Breakup by Material Used 
9.3.6.5 Market Breakup by End User
9.3.6.6 Key Players
9.3.6.7 Market Forecast (2025-2033)
9.3.7 Others
9.3.7.1 Historical and Current Market Trends (2019-2024)
9.3.7.2 Market Forecast (2025-2033)
9.4 Latin America
9.4.1 Brazil

9.4.1.1 Market Drivers
9.4.1.2 Historical and Current Market Trends (2019-2024)
9.4.1.3 Market Breakup by Components
9.4.1.4 Market Breakup by Material Used  
9.4.1.5 Market Breakup by End User
9.4.1.6 Key Players
9.4.1.7 Market Forecast (2025-2033)
9.4.2 Mexico
9.4.2.1 Market Drivers
9.4.2.2 Historical and Current Market Trends (2019-2024)
9.4.2.3 Market Breakup by Components
9.4.2.4 Market Breakup by Material Used 
9.4.2.5 Market Breakup by End User
9.4.2.6 Key Players
9.4.2.7 Market Forecast (2025-2033)
9.4.3 Others
9.4.3.1 Historical and Current Market Trends (2019-2024)
9.4.3.2 Market Forecast (2025-2033)
9.5 Middle East and Africa
9.5.1.1 Market Drivers
9.5.1.2 Historical and Current Market Trends (2019-2024)
9.5.1.3 Market Breakup by Components
9.5.1.4 Market Breakup by Material Used 
9.5.1.5 Market Breakup by End User
9.5.1.6 Market Breakup by Country
9.5.1.7 Key Players
9.5.1.8 Market Forecast (2025-2033)
9.6 Attractive Investment Proposition by Region

10 Global Semiconductor Market – Competitive Landscape
10.1 Overview
10.2 Market Structure
10.3 Market Share by Key Players
10.4 Market Player Positioning
10.5 Top Winning Strategies
10.6 Competitive Dashboard

10.7 Company Evaluation Quadrant

11 Profiles of Key Players
11.1 Broadcom Inc.

11.1.1 Business Overview
11.1.2 Product Portfolio
11.1.3 Business Strategies
11.1.4 Financials
11.1.5 SWOT Analysis
11.1.6 Major News and Events
11.2 Infineon Technologies AG
11.2.1 Business Overview
11.2.2 Product Portfolio
11.2.3 Business Strategies
11.2.4 Financials
11.2.5 SWOT Analysis
11.2.6 Major News and Events
11.3 Intel Corporation
11.3.1 Business Overview
11.3.2 Product Portfolio
11.3.3 Business Strategies
11.4.4 Financials
11.3.5 SWOT Analysis
11.3.6 Major News and Events
11.4 Micron Technology Inc.
11.4.1 Business Overview
11.4.2 Product Portfolio
11.4.3 Business Strategies
11.4.4 Financials
11.4.5 SWOT Analysis
11.4.6 Major News and Events
11.5 NXP Semiconductors N.V.
11.5.1 Business Overview
11.5.2 Product Portfolio
11.5.3 Business Strategies
11.5.4 Financials
11.5.5 SWOT Analysis
11.5.6 Major News and Events
11.6 Renesas Electronics Corporation
11.6.1 Business Overview
11.6.2 Product Portfolio
11.6.3 Business Strategies
11.6.4 Financials
11.6.5 SWOT Analysis
11.6.6 Major News and Events
11.7 Samsung Electronics Co. Ltd. 
11.7.1 Business Overview
11.7.2 Product Portfolio
11.7.3 Business Strategies
11.7.4 Financials
11.7.5 SWOT Analysis
11.7.6 Major News and Events
11.8 SK hynix Inc.
11.8.1 Business Overview
11.8.2 Product Portfolio
11.8.3 Business Strategies
11.8.4 Financials
11.8.5 SWOT Analysis
11.8.6 Major News and Events
11.9 STMicroelectronics N.V.
11.9.1 Business Overview
11.9.2 Product Portfolio
11.9.3 Business Strategies
11.9.4 SWOT Analysis
11.9.5 Major News and Events
11.10 Taiwan Semiconductor Manufacturing Company Limited
11.10.1 Business Overview
11.10.2 Product Portfolio
11.10.3 Business Strategies
11.10.4 Financials
11.10.5 SWOT Analysis
11.10.6 Major News and Events
11.11 Texas Instruments Incorporated
11.11.1 Business Overview
11.11.2 Product Portfolio
11.11.3 Business Strategies
11.11.4 Financials
11.11.5 SWOT Analysis
11.11.6 Major News and Events
11.12 Toshiba Electronic Devices & Storage Corporation (Toshiba Corporation)
11.12.1 Business Overview
11.12.2 Product Portfolio
11.12.3 Business Strategies
11.12.4 SWOT Analysis
11.12.5 Major News and Events

Kindly note that this only represents a partial list of companies, and the complete list has been provided in the report.

12 Global Semiconductor Market - Industry Analysis
12.1 Drivers, Restraints, and Opportunities
12.1.1    Overview
12.1.2    Drivers
12.1.3    Restraints
12.1.4    Opportunities
12.1.5    Impact Analysis
12.2 Porters Five Forces Analysis
12.2.1    Overview
12.2.2    Bargaining Power of Buyers
12.2.3    Bargaining Power of Suppliers
12.2.4    Degree of Competition
12.2.5    Threat of New Entrants
12.2.6    Threat of Substitutes
12.3 Value Chain Analysis

13 Strategic Recommendations

14 Appendix

Semiconductor Market Report by Components (Memory Devices, Logic Devices, Analog IC, MPU, Discrete Power Devices, MCU, Sensors, and Others), Material Used (Silicon Carbide, Gallium Manganese Arsenide, Copper Indium Gallium Selenide, Molybdenum Disulfide, and Others), End User (Automotive, Industrial, Data Centre, Telecommunication, Consumer Electronics, Aerospace and Defense, Healthcare, and Others), and Region 2025-2033
Purchase Options New Year Sale
Benefits of Customization
  • Personalize this research
  • Triangulate with your data
  • Get data as per your format and definition
  • Gain a deeper dive into a specific application, geography, customer, or competitor
  • Any level of personalization

Get in Touch With Us

UNITED STATES

Phone: +1-631-791-1145

INDIA

Phone: +91-120-433-0800

UNITED KINGDOM

Phone: +44-753-714-6104

Email: sales@imarcgroup.com

Client Testimonials