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半導体市場レポート 部品別（メモリデバイス、ロジックデバイス、アナログIC、MPU、ディスクリートパワーデバイス、MCU、センサー、その他）、使用材料別（炭化ケイ素、ガリウムマンガン砒素、セレン化銅インジウムガリウム、二硫化モリブデン、その他）、エンドユーザー別（自動車、産業、データセンター、通信、民生用電子機器、航空宇宙・防衛、ヘルスケア、その他）、地域別 2024-2032
Report Format: PDF+Excel | Report ID: SR112024A24865
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Language of the Report – English
ただし、追加料金で日本語のレポートが入手できる場合もある。
1 Preface
2 Scope and Methodology
2.1 Objectives of the Study
2.2 Stakeholders
2.3 Data Sources
2.3.1 Primary Sources
2.3.2 Secondary Sources
2.4 Market Estimation
2.4.1 Bottom-Up Approach
2.4.2 Top-Down Approach
2.5 Forecasting Methodology
3 Executive Summary
4 Global Semiconductor Market - Introduction
4.1 Overview
4.2 Market Dynamics
4.3 Industry Trends
4.4 Competitive Intelligence
5 Global Semiconductor Market Landscape
5.1 Historical and Current Market Trends (2018-2023)
5.2 Market Forecast (2024-2032)
6 Global Semiconductor Market - Breakup by Components
6.1 Memory Devices
6.1.1 Overview
6.1.2 Historical and Current Market Trends (2018-2023)
6.1.3 Market Segmentation
6.1.4 Market Forecast (2024-2032)
6.2 Logic Devices
6.2.1 Overview
6.2.2 Historical and Current Market Trends (2018-2023)
6.2.3 Market Segmentation
6.2.4 Market Forecast (2024-2032)
6.3 Analog IC
6.3.1 Overview
6.3.2 Historical and Current Market Trends (2018-2023)
6.3.3 Market Segmentation
6.3.4 Market Forecast (2024-2032)
6.4 MPU
6.4.1 Overview
6.4.2 Historical and Current Market Trends (2018-2023)
6.4.3 Market Segmentation
6.4.4 Market Forecast (2024-2032)
6.5 Discrete Power Devices
6.5.1 Overview
6.5.2 Historical and Current Market Trends (2018-2023)
6.5.3 Market Segmentation
6.5.4 Market Forecast (2024-2032)
6.6 MCU
6.6.1 Overview
6.6.2 Historical and Current Market Trends (2018-2023)
6.6.3 Market Segmentation
6.6.4 Market Forecast (2024-2032)
6.7 Sensors
6.7.1 Overview
6.7.2 Historical and Current Market Trends (2018-2023)
6.7.3 Market Segmentation
6.7.4 Market Forecast (2024-2032)
6.8 Others
6.8.1 Historical and Current Market Trends (2018-2023)
6.8.2 Market Forecast (2024-2032)
6.9 Attractive Investment Proposition by Components
7 Global Semiconductor Market - Breakup by Material Used
7.1 Silicon Carbide
7.1.1 Overview
7.1.2 Historical and Current Market Trends (2018-2023)
7.1.3 Market Segmentation
7.1.4 Market Forecast (2024-2032)
7.2 Gallium Manganese Arsenide
7.2.1 Overview
7.2.2 Historical and Current Market Trends (2018-2023)
7.2.3 Market Segmentation
7.2.4 Market Forecast (2024-2032)
7.3 Copper Indium Gallium Selenide
7.3.1 Overview
7.3.2 Historical and Current Market Trends (2018-2023)
7.3.3 Market Segmentation
7.3.4 Market Forecast (2024-2032)
7.4 Molybdenum Disulfide
7.4.1 Overview
7.4.2 Historical and Current Market Trends (2018-2023)
7.4.3 Market Segmentation
7.4.4 Market Forecast (2024-2032)
7.5 Others
7.5.1 Historical and Current Market Trends (2018-2023)
7.5.2 Market Forecast (2024-2032)
7.6 Attractive Investment Proposition by Material Used
8 Global Semiconductor Market - Breakup by End User
8.1 Automotive
8.1.1 Overview
8.1.2 Historical and Current Market Trends (2018-2023)
8.1.3 Market Segmentation
8.1.4 Market Forecast (2024-2032)
8.2 Industrial
8.2.1 Overview
8.2.2 Historical and Current Market Trends (2018-2023)
8.2.3 Market Segmentation
8.2.4 Market Forecast (2024-2032)
8.3 Data Centre
8.3.1 Overview
8.3.2 Historical and Current Market Trends (2018-2023)
8.3.3 Market Segmentation
8.3.4 Market Forecast (2024-2032)
8.4 Telecommunication
8.4.1 Overview
8.4.2 Historical and Current Market Trends (2018-2023)
8.4.3 Market Segmentation
8.4.4 Market Forecast (2024-2032)
8.5 Consumer Electronics
8.5.1 Overview
8.5.2 Historical and Current Market Trends (2018-2023)
8.5.3 Market Segmentation
8.5.4 Market Forecast (2024-2032)
8.6 Aerospace and Defense
8.6.1 Overview
8.6.2 Historical and Current Market Trends (2018-2023)
8.6.3 Market Segmentation
8.6.4 Market Forecast (2024-2032)
8.7 Healthcare
8.7.1 Overview
8.7.2 Historical and Current Market Trends (2018-2023)
8.7.3 Market Segmentation
8.7.4 Market Forecast (2024-2032)
8.8 Others
8.8.1 Historical and Current Market Trends (2018-2023)
8.8.2 Market Forecast (2024-2032)
8.9 Attractive Investment Proposition by End User
9 Global Semiconductor Market – Breakup by Region
9.1 North America
9.1.1 United States
9.1.1.1 Market Drivers
9.1.1.2 Historical and Current Market Trends (2018-2023)
9.1.1.3 Market Breakup by Components
9.1.1.4 Market Breakup by Material Used
9.1.1.5 Market Breakup by End User
9.1.1.6 Key Players
9.1.1.7 Market Forecast (2024-2032)
9.1.2 Canada
9.1.2.1 Market Drivers
9.1.2.2 Historical and Current Market Trends (2018-2023)
9.1.2.3 Market Breakup by Components
9.1.2.4 Market Breakup by Material Used
9.1.2.5 Market Breakup by End User
9.1.2.6 Key Players
9.1.2.7 Market Forecast (2024-2032)
9.2 Europe
9.2.1 Germany
9.2.1.1 Market Drivers
9.2.1.2 Historical and Current Market Trends (2018-2023)
9.2.1.3 Market Breakup by Components
9.2.1.4 Market Breakup by Material Used
9.2.1.5 Market Breakup by End User
9.2.1.6 Key Players
9.2.1.7 Market Forecast (2024-2032)
9.2.2 France
9.2.2.1 Market Drivers
9.2.2.2 Historical and Current Market Trends (2018-2023)
9.2.2.3 Market Breakup by Components
9.2.2.4 Market Breakup by Material Used
9.2.2.5 Market Breakup by End User
9.2.2.6 Key Players
9.2.2.7 Market Forecast (2024-2032)
9.2.3 United Kingdom
9.2.3.1 Market Drivers
9.2.3.2 Historical and Current Market Trends (2018-2023)
9.2.3.3 Market Breakup by Components
9.2.3.4 Market Breakup by Material Used
9.2.3.5 Market Breakup by End User
9.2.3.6 Key Players
9.2.3.7 Market Forecast (2024-2032)
9.2.4 Italy
9.2.4.1 Market Drivers
9.2.4.2 Historical and Current Market Trends (2018-2023)
9.2.4.3 Market Breakup by Components
9.2.4.4 Market Breakup by Material Used
9.2.4.5 Market Breakup by End User
9.2.4.6 Key Players
9.2.4.7 Market Forecast (2024-2032)
9.2.5 Spain
9.2.5.1 Market Drivers
9.2.5.2 Historical and Current Market Trends (2018-2023)
9.2.5.3 Market Breakup by Components
9.2.5.4 Market Breakup by Material Used
9.2.5.5 Market Breakup by End User
9.2.5.6 Key Players
9.2.5.7 Market Forecast (2024-2032)
9.2.6 Others
9.2.6.1 Historical and Current Market Trends (2018-2023)
9.2.6.2 Market Forecast (2024-2032)
9.3 Asia Pacific
9.3.1 China
9.3.1.1 Market Drivers
9.3.1.2 Historical and Current Market Trends (2018-2023)
9.3.1.3 Market Breakup by Components
9.3.1.4 Market Breakup by Material Used
9.3.1.5 Market Breakup by End User
9.3.1.6 Key Players
9.3.1.7 Market Forecast (2024-2032)
9.3.2 Japan
9.3.2.1 Market Drivers
9.3.2.2 Historical and Current Market Trends (2018-2023)
9.3.2.3 Market Breakup by Components
9.3.2.4 Market Breakup by Material Used
9.3.2.5 Market Breakup by End User
9.3.2.6 Key Players
9.3.2.7 Market Forecast (2024-2032)
9.3.3 India
9.3.3.1 Market Drivers
9.3.3.2 Historical and Current Market Trends (2018-2023)
9.3.3.3 Market Breakup by Components
9.3.3.4 Market Breakup by Material Used
9.3.3.5 Market Breakup by End User
9.3.3.6 Key Players
9.3.3.7 Market Forecast (2024-2032)
9.3.4 South Korea
9.3.4.1 Market Drivers
9.3.4.2 Historical and Current Market Trends (2018-2023)
9.3.4.3 Market Breakup by Components
9.3.4.4 Market Breakup by Material Used
9.3.4.5 Market Breakup by End User
9.3.4.6 Key Players
9.3.4.7 Market Forecast (2024-2032)
9.3.5 Australia
9.3.5.1 Market Drivers
9.3.5.2 Historical and Current Market Trends (2018-2023)
9.3.5.3 Market Breakup by Components
9.3.5.4 Market Breakup by Material Used
9.3.5.5 Market Breakup by End User
9.3.5.6 Key Players
9.3.5.7 Market Forecast (2024-2032)
9.3.6 Indonesia
9.3.6.1 Market Drivers
9.3.6.2 Historical and Current Market Trends (2018-2023)
9.3.6.3 Market Breakup by Components
9.3.6.4 Market Breakup by Material Used
9.3.6.5 Market Breakup by End User
9.3.6.6 Key Players
9.3.6.7 Market Forecast (2024-2032)
9.3.7 Others
9.3.7.1 Historical and Current Market Trends (2018-2023)
9.3.7.2 Market Forecast (2024-2032)
9.4 Latin America
9.4.1 Brazil
9.4.1.1 Market Drivers
9.4.1.2 Historical and Current Market Trends (2018-2023)
9.4.1.3 Market Breakup by Components
9.4.1.4 Market Breakup by Material Used
9.4.1.5 Market Breakup by End User
9.4.1.6 Key Players
9.4.1.7 Market Forecast (2024-2032)
9.4.2 Mexico
9.4.2.1 Market Drivers
9.4.2.2 Historical and Current Market Trends (2018-2023)
9.4.2.3 Market Breakup by Components
9.4.2.4 Market Breakup by Material Used
9.4.2.5 Market Breakup by End User
9.4.2.6 Key Players
9.4.2.7 Market Forecast (2024-2032)
9.4.3 Others
9.4.3.1 Historical and Current Market Trends (2018-2023)
9.4.3.2 Market Forecast (2024-2032)
9.5 Middle East and Africa
9.5.1.1 Market Drivers
9.5.1.2 Historical and Current Market Trends (2018-2023)
9.5.1.3 Market Breakup by Components
9.5.1.4 Market Breakup by Material Used
9.5.1.5 Market Breakup by End User
9.5.1.6 Market Breakup by Country
9.5.1.7 Key Players
9.5.1.8 Market Forecast (2024-2032)
9.6 Attractive Investment Proposition by Region
10 Global Semiconductor Market – Competitive Landscape
10.1 Overview
10.2 Market Structure
10.3 Market Share by Key Players
10.4 Market Player Positioning
10.5 Top Winning Strategies
10.6 Competitive Dashboard
10.7 Company Evaluation Quadrant
11 Profiles of Key Players
11.1 Broadcom Inc.
11.1.1 Business Overview
11.1.2 Product Portfolio
11.1.3 Business Strategies
11.1.4 Financials
11.1.5 SWOT Analysis
11.1.6 Major News and Events
11.2 Infineon Technologies AG
11.2.1 Business Overview
11.2.2 Product Portfolio
11.2.3 Business Strategies
11.2.4 Financials
11.2.5 SWOT Analysis
11.2.6 Major News and Events
11.3 Intel Corporation
11.3.1 Business Overview
11.3.2 Product Portfolio
11.3.3 Business Strategies
11.4.4 Financials
11.3.5 SWOT Analysis
11.3.6 Major News and Events
11.4 Micron Technology Inc.
11.4.1 Business Overview
11.4.2 Product Portfolio
11.4.3 Business Strategies
11.4.4 Financials
11.4.5 SWOT Analysis
11.4.6 Major News and Events
11.5 NXP Semiconductors N.V.
11.5.1 Business Overview
11.5.2 Product Portfolio
11.5.3 Business Strategies
11.5.4 Financials
11.5.5 SWOT Analysis
11.5.6 Major News and Events
11.6 Renesas Electronics Corporation
11.6.1 Business Overview
11.6.2 Product Portfolio
11.6.3 Business Strategies
11.6.4 Financials
11.6.5 SWOT Analysis
11.6.6 Major News and Events
11.7 Samsung Electronics Co. Ltd.
11.7.1 Business Overview
11.7.2 Product Portfolio
11.7.3 Business Strategies
11.7.4 Financials
11.7.5 SWOT Analysis
11.7.6 Major News and Events
11.8 SK hynix Inc.
11.8.1 Business Overview
11.8.2 Product Portfolio
11.8.3 Business Strategies
11.8.4 Financials
11.8.5 SWOT Analysis
11.8.6 Major News and Events
11.9 STMicroelectronics N.V.
11.9.1 Business Overview
11.9.2 Product Portfolio
11.9.3 Business Strategies
11.9.4 SWOT Analysis
11.9.5 Major News and Events
11.10 Taiwan Semiconductor Manufacturing Company Limited
11.10.1 Business Overview
11.10.2 Product Portfolio
11.10.3 Business Strategies
11.10.4 Financials
11.10.5 SWOT Analysis
11.10.6 Major News and Events
11.11 Texas Instruments Incorporated
11.11.1 Business Overview
11.11.2 Product Portfolio
11.11.3 Business Strategies
11.11.4 Financials
11.11.5 SWOT Analysis
11.11.6 Major News and Events
11.12 Toshiba Electronic Devices & Storage Corporation (Toshiba Corporation)
11.12.1 Business Overview
11.12.2 Product Portfolio
11.12.3 Business Strategies
11.12.4 SWOT Analysis
11.12.5 Major News and Events
Kindly note that this only represents a partial list of companies, and the complete list has been provided in the report.
12 Global Semiconductor Market - Industry Analysis
12.1 Drivers, Restraints, and Opportunities
12.1.1 Overview
12.1.2 Drivers
12.1.3 Restraints
12.1.4 Opportunities
12.1.5 Impact Analysis
12.2 Porters Five Forces Analysis
12.2.1 Overview
12.2.2 Bargaining Power of Buyers
12.2.3 Bargaining Power of Suppliers
12.2.4 Degree of Competition
12.2.5 Threat of New Entrants
12.2.6 Threat of Substitutes
12.3 Value Chain Analysis
13 Strategic Recommendations
14 Appendix
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