The Saudi Arabia advanced packaging market size reached USD 411.6 Million in 2024. Looking forward, IMARC Group expects the market to reach USD 1,057.8 Million by 2033, exhibiting a growth rate (CAGR) of 9.9% during 2025-2033. The rising investments in semiconductor manufacturing, growing demand for consumer electronics, increasing adoption of AI and IoT devices, government initiatives under Vision 2030 to boost tech infrastructure, and the emergence of 5G technology are driving the growth of the market in Saudi Arabia, supporting innovation and local production capabilities.
Report Attribute
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Key Statistics
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Base Year
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2024 |
Forecast Years
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2025-2033
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Historical Years
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2019-2024
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Market Size in 2024 | USD 411.6 Million |
Market Forecast in 2033 | USD 1,057.8 Million |
Market Growth Rate 2025-2033 | 9.9% |
Growing Demand for Consumer Electronics
The expanding consumer electronics sector in Saudi Arabia is a key driver augmenting the Saudi Arabia advanced packaging market share. Rising disposable incomes, urbanization, and digital lifestyle adoption are fueling high consumption of smartphones, tablets, smart TVs, wearable devices, and connected home appliances. According to an industry report, Saudi Arabia's smartphone users raised from 14.31 Million in 2013 to 33.55 Million in 2024. These products require high-performance, miniaturized chips with increased functionality and energy efficiency, capabilities enabled through advanced packaging methods such as fan-in/fan-out wafer-level packaging, flip-chip, and 3D stacking. Furthermore, Saudi Arabia's young, tech-savvy population and high smartphone penetration rate are accelerating the adoption of next-generation mobile devices, many of which integrate AI and 5G capabilities. These technical demands cannot be met with conventional packaging techniques. The demand for thinner devices with faster processing speeds and extended battery life is pushing manufacturers to adopt compact packaging technologies that reduce form factor while enhancing thermal and electrical performance, which is positively impacting Saudi Arabia advanced packaging market outlook. As global brands respond to this demand with increasingly complex chips, advanced packaging plays a crucial role in supporting high interconnect density, bandwidth efficiency, and thermal control.
Rising Demand from Automotive and Industrial Applications
The market in Saudi Arabia is gaining momentum due to increasing demand from automotive and industrial electronics, driven by national priorities around electric mobility and smart manufacturing. As part of its broader sustainability and innovation goals, Saudi Arabia plans for 30% of vehicles in Riyadh to be electric by 2030. This target is spurring demand for high-performance semiconductor components used in electric drivetrains, battery management systems, and advanced driver-assistance systems (ADAS). These components require packaging solutions that ensure thermal stability, compact form factors, and robust signal integrity needs met by advanced formats like flip-chip, wafer-level, and embedded die packaging. Apart from this, industrial applications, including robotics, predictive maintenance platforms, and energy management systems are demanding packaging solutions that enable robust signal integrity and environmental durability, which is providing an impetus to Saudi Arabia advanced packaging market growth. With Saudi Arabia actively investing in manufacturing zones dedicated to automotive assembly and industrial automation, there is a growing market for locally packaged semiconductor components. This shift is prompting greater interest in outsourced semiconductor assembly and test (OSAT) services and encouraging regional capacity-building to serve domestic OEMs and tier-1 suppliers more efficiently.
IMARC Group provides an analysis of the key trends in each segment of the market, along with forecasts at the country level for 2025-2033. Our report has categorized the market based on type and end use.
Type Insights:
The report has provided a detailed breakup and analysis of the market based on the type. This includes flip-chip ball grid array, flip chip CSP, wafer level CSP, 5D/3D, fan out WLP, and others.
End Use Insights:
A detailed breakup and analysis of the market based on the end use have also been provided in the report. This includes consumer electronics, automotive, industrial, healthcare, aerospace and defense, and others.
Regional Insights:
The report has also provided a comprehensive analysis of all the major regional markets, which include Northern and Central Region, Western Region, Eastern Region, and Southern Region.
The market research report has also provided a comprehensive analysis of the competitive landscape. Competitive analysis such as market structure, key player positioning, top winning strategies, competitive dashboard, and company evaluation quadrant has been covered in the report. Also, detailed profiles of all major companies have been provided.
Report Features | Details |
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Base Year of the Analysis | 2024 |
Historical Period | 2019-2024 |
Forecast Period | 2025-2033 |
Units | Million USD |
Scope of the Report | Exploration of Historical Trends and Market Outlook, Industry Catalysts and Challenges, Segment-Wise Historical and Future Market Assessment:
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Types Covered | Flip-Chip Ball Grid Array, Flip Chip CSP, Wafer Level CSP, 5D/3D, Fan Out WLP, Others |
End Uses Covered | Consumer Electronics, Automotive, Industrial, Healthcare, Aerospace and Defense, Others |
Regions Covered | Northern and Central Region, Western Region, Eastern Region, Southern Region |
Customization Scope | 10% Free Customization |
Post-Sale Analyst Support | 10-12 Weeks |
Delivery Format | PDF and Excel through Email (We can also provide the editable version of the report in PPT/Word format on special request) |
Key Questions Answered in This Report:
Key Benefits for Stakeholders: