High-Density Interconnect (HDI) PCB Market

Market Overview:

The global high-density interconnect (HDI) PCB market size reached USD 9.1 Billion in 2024. Looking forward, IMARC Group expects the market to reach USD 13.9 Billion by 2033, exhibiting a growth rate (CAGR) of 4.59% during 2025-2033. The market is experiencing significant growth due to the rising demand for compact, high-performance electronics. Features like reduced size, enhanced electrical performance, and multi-layered structures make HDI PCBs crucial for smartphones, automotive, and medical devices. The innovations in miniaturization and high-speed data processing, is also contributing positively to the market growth.

Interconnecting printed circuit boards (PCBs) with high-density interconnects (HDIs) are circuit boards having a better wiring density per unit than conventional circuit boards. With blind and buried vias, it contains micro-vias that are smaller in diameter and have a relatively greater pad density than conventional circuit boards while having a higher circuitry density than traditional counterparts. High-density PCB technology has allowed engineers an enhanced design freedom and flexibility, thus allowing them to place smaller and closer components, which reduces signal loss and crossing delays. An interconnect PCB with high density gives designers more surface area to work with. As a result, high-density interconnect PCBs deliver better signal quality and faster signal transmission.

High-Density Interconnect (HDI) PCB Market Trends:

Growth in Automotive Electronics

The growth in automotive electronics is significantly driving the High-Density Interconnect PCB market growth. Advanced driver-assistance systems (ADAS), electric vehicles (EVs), and in-car infotainment systems demand sophisticated, compact PCBs capable of handling complex circuitry with high reliability. According to an article published by the International Energy Agency (IEA), in 2023, nearly 14 million electric cars were sold globally and electric vehicles comprised 18% of all car sales, with battery electric vehicles making up 70% of the stock. HDI technology enables the integration of dense components and fine interconnections, reducing board size while enhancing performance. Additionally, the increasing electrical and thermal requirements in modern vehicles necessitate HDI PCBs to provide efficient heat dissipation and maintain signal integrity. This trend toward smarter, more connected vehicles propels the adoption of HDI PCBs, fostering innovation and supporting the evolution of automotive technologies.

Expansion of 5G and IoT Application

The expansion of 5G and IoT applications is significantly driving the demand for High-Density Interconnect (HDI) PCBs. These advanced PCBs are essential for managing high-speed data transmission and ensuring robust connectivity required by 5G networks and IoT devices. HDI technology features finer lines and smaller vias, allowing for higher component densities and reduced signal interference, which are critical for maintaining performance and reliability in these high-demand applications. Additionally, HDI PCBs enable the compact integration of complex circuitry, supporting the development of smart cities, autonomous systems, and connected devices. This capability ensures scalable and efficient solutions, meeting the stringent requirements of modern communication infrastructures and the rapidly growing IoT ecosystem.

Increased Focus on Miniaturization and Lightweighting

The push for miniaturization and lightweighting in electronics drives the adoption of HDI PCBs, which enable higher component densities within smaller board footprints. By utilizing finer lines, microvias, and multi-layer constructions, HDI PCBs allow for compact designs without sacrificing functionality or performance. For instance, in June 2023, Apple announced its plans to introduce resin-coated copper (RCC) materials in its iPhone models in 2024, replacing some copper-clad laminates. This change aims to reduce mainboard thickness, enhance signal efficiency, and increase battery capacity, marking the first significant PCB upgrade since the iPhone X launched. This is essential for devices such as smartphones, wearables, medical implants, and portable gadgets, where space and weight are critical constraints. Additionally, lighter and smaller PCBs contribute to enhanced device portability and user comfort. The ability to integrate more features into slimmer profiles also fosters innovation, enabling manufacturers to develop advanced, feature-rich products that meet consumer demands for sleek and efficient technology.

Key Market Segmentation:

IMARC Group provides an analysis of the key trends in each sub-segment of the global high-density interconnect (HDI) PCB market report, along with forecasts at the global, regional and country levels from 2025-2033. Our report has categorized the market based on number of HDI layer and end use industry.

Breakup by Number of HDI Layer:

• 4-6 Layers HDI PCBs
• 8-10 Layer HDI PCBs
• 10+ Layer HDI PCBs
   

Breakup by End Use Industry:

• Smartphones and Tablets
• Computers
• Telecom/Datacom
• Consumer Electronics
• Automotive
• Others
   

Breakup by Region:

• North America
  • United States
  • Canada
• Asia-Pacific
  • China
  • Japan
  • India
  • South Korea
  • Australia
  • Indonesia
  • Others
• Europe
  • Germany
  • France
  • United Kingdom
  • Italy
  • Spain
  • Russia
  • Others
• Latin America
  • Brazil
  • Mexico
  • Others
• Middle East and Africa
   

Competitive Landscape:

The report has also provided a comprehensive analysis of the competitive landscape in the global high-density interconnect (HDI) PCB market. Detailed profiles of all major companies have also been provided. Some of the companies covered include:

• AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
• Bittele Electronics Inc.
• Fineline Ltd.
• Meiko Electronics Co. Ltd.
• Millennium Circuits Limited
• Mistral Solutions Pvt. Ltd.
• Shenzhen Kinwong Electronic Co. Ltd.
• Sierra Circuits
• TTM Technologies Inc.
• Unimicron Technology Corporation (United Microelectronics Corporation)
• Unitech Printed Circuit Board Corp.
• Würth Elektronik GmbH & Co. KG
   

Kindly note that this only represents a partial list of companies, and the complete list has been provided in the report

High-Density Interconnect (HDI) PCB Market News:

• In October 2024, Amber Group announced their partnership with Korea Circuit to form a joint venture for manufacturing high-density interconnect (HDI), flexible, and semiconductor substrate PCBs in India. With Amber holding a 70% stake, the initiative supports the Indian government's ‘Aatmanirbhar Bharat’ vision, aiming to enhance local electronics production and meet growing demand.
• In November 2023, Kaynes Technology announced its plans to shift focus from traditional Printed Circuit Boards (PCBs) to High-Density Interconnect (HDI) board manufacturing, allocating 60-70% of its capacity to HDI projects. This strategic move aims to enhance its position in the Electronic Manufacturing Services (EMS) sector by targeting high-end applications in industries such as automotive, consumer electronics, and medical devices.
• In November 2023, TTM Technologies announced their plans to invest $130 million in a new DeWitt facility to enhance the U.S. microelectronics supply chain, focusing on ultra-high-density interconnect PCBs for military use.

Report Coverage: