The global atomic layer deposition equipment market size reached USD 7.5 Billion in 2024. Looking forward, IMARC Group expects the market to reach USD 24.2 Billion by 2033, exhibiting a growth rate (CAGR) of 13.92% during 2025-2033.
Report Attribute
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Key Statistics
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Base Year
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2024
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Forecast Years
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2025-2033
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Historical Years
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2019-2024
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Market Size in 2024
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USD 7.5 Billion |
Market Forecast in 2033
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USD 24.2 Billion |
Market Growth Rate 2025-2033 | 13.92% |
Atomic layer deposition (ALD) refers to a vapor phase technique that is deployed for depositing ultra-thin films on top of a substrate after getting exposed to alternating precursors. Some of the commonly used equipment includes single wafer, batch, plasma, large substrate ALD reactors, thin-film electroluminescent (TFEL) displays and other electronic components. These tools help in ensuring uniformity by controlling the thickness and improving or modifying various properties of substrates, including resistance, conductivity, and strength. On account of these properties, it is used in semiconductors, electronics, optical devices, fuel cells and thermoelectric materials. At present, atomic layer deposition equipment is commercially available in varying types, such as metal, plasma-enhanced, aluminum oxide, and catalytic.
The widespread adoption of ALD equipment across various research and development (R&D) facilities, healthcare, and solar sector on account of the increasing need for flexible tools to improve functionality and offer higher accuracy is primarily driving the market growth. In line with this, the rising demand for miniaturization, semiconductors, and power management systems in electronic materials for depositing various products, including data storage, small electronic components and display devices are further contributing to the market growth. This is further supported by the utilization of atomic layer deposition equipment for manufacturing integrated circuits (IC), chips, and micro-electromechanical systems (MEMS) products, such as optical switches, sensors, and computers. In line with this, significant technological advancements have led to the introduction of spatial ALD for flexible electronics and three-dimensional (3D) printed reactors to ensure uniformity and conformity of complex 3D nanostructures, which is acting as another growth-inducing factor. Additionally, the escalating requirement for solid-state thin-film batteries due to the increasing uptake of implantable, smartwatches, smartphones and medical equipment is contributing to the market growth. Apart from this, strategic collaborations amongst key players for launching plasma-enhanced ALD are creating a positive outlook for the market.
IMARC Group provides an analysis of the key trends in each sub-segment of the global atomic layer deposition equipment market report, along with forecasts at the global, regional and country level from 2025-2033. Our report has categorized the market based on product and application.
Breakup by Product:
Breakup by Application:
Breakup by Region:
The competitive landscape of the industry has also been examined along with the profiles of the key players being Arradiance LLC, ASM International, Beneq Oy, CVD Equipment Corporation, Forge Nano Inc., Kurt J. Lesker Company, Lam Research Corporation, Oxford Instruments plc, Picosun Oy (Applied Materials Inc.), SENTECH Instruments GmbH, Veeco Instruments Inc., Wonik IPS Co. Ltd. and Tokyo Electron Limited.
Report Features | Details |
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Base Year of the Analysis | 2024 |
Historical Period | 2019-2024 |
Forecast Period | 2025-2033 |
Units | Billion USD |
Segment Coverage | Product, Application, Region |
Region Covered | Asia Pacific, Europe, North America, Latin America, Middle East and Africa |
Countries Covered | United States, Canada, Germany, France, United Kingdom, Italy, Spain, Russia, China, Japan, India, South Korea, Australia, Indonesia, Brazil, Mexico |
Companies Covered | Arradiance LLC, ASM International, Beneq Oy, CVD Equipment Corporation, Forge Nano Inc., Kurt J. Lesker Company, Lam Research Corporation, Oxford Instruments plc, Picosun Oy (Applied Materials Inc.), SENTECH Instruments GmbH, Veeco Instruments Inc., Wonik IPS Co. Ltd. and Tokyo Electron Limited |
Customization Scope | 10% Free Customization |
Post-Sale Analyst Support | 10-12 Weeks |
Delivery Format | PDF and Excel through Email (We can also provide the editable version of the report in PPT/Word format on special request) |
The global atomic layer deposition equipment market was valued at USD 7.5 Billion in 2024.
We expect the global atomic layer deposition equipment market to exhibit a CAGR of 13.92% during 2025-2033
The sudden outbreak of the COVID-19 pandemic had led to the implementation of stringent lockdown regulations across several nations, resulting in the temporary closure of numerous manufacturing units for atomic layer deposition equipment.
The rising demand for atomic layer deposition equipment for manufacturing Integrated Circuits (ICs), chips, and Micro-Electromechanical Systems (MEMS) products, such as optical switches, sensors, and computers, is primarily driving the global atomic layer deposition equipment market.
Based on the product, the global atomic layer deposition equipment market has been segregated into metal ALD, aluminum oxide ALD, plasma enhanced ALD, catalytic ALD, and others. Among these, aluminum oxide ALD currently holds the largest market share.
Based on the application, the global atomic layer deposition equipment market can be bifurcated into semiconductors, solar devices, electronics, medical equipment, and others. Currently, semiconductors exhibit a clear dominance in the market.
On a regional level, the market has been classified into North America, Asia-Pacific, Europe, Latin America, and Middle East and Africa, where Asia-Pacific currently dominates the global market.
Some of the major players in the global atomic layer deposition equipment market include Arradiance LLC, ASM International, Beneq Oy, CVD Equipment Corporation, Forge Nano Inc., Kurt J. Lesker Company, Lam Research Corporation, Oxford Instruments plc, Picosun Oy (Applied Materials Inc.), SENTECH Instruments GmbH, Veeco Instruments Inc., Wonik IPS Co. Ltd., and Tokyo Electron Limited.