The Asia Pacific chip mounter market size reached USD 2.6 Billion in 2024. Looking forward, IMARC Group expects the market to reach USD 3.8 Billion by 2033, exhibiting a growth rate (CAGR) of 4.2% during 2025-2033.
Report Attribute
|
Key Statistics
|
---|---|
Base Year
|
2024
|
Forecast Years
|
2025-2033
|
Historical Years
|
2019-2024
|
Market Size in 2024
|
USD 2.6 Billion |
Market Forecast in 2033
|
USD 3.8 Billion |
Market Growth Rate 2025-2033 | 4.2% |
A chip mounter is a robotic device used to place mounted devices on printed circuit boards. The chip mounting technology resurfaced as surface mounting technology. However, surface mounting technology involves the placement of chips directly on PCBs without creating holes through the soldering process. The process helps manufacturers to save space and place more chips on the same board. Moreover, research and development have led to advancements in technology, resulting in the introduction of Fine Pitch technology that offers a higher circuit density compared to the surface mounted technology. Both these technologies are used by manufacturers to produce chips mounted on substrates.
The Asia Pacific chip mounter market is primarily driven by the well-established electronics manufacturing industry in China. Regional governments are also supporting the industry with the implementation of favorable regulations. Furthermore, the flourishing industrial market due to the ongoing push for safer and smart cities in the Asia Pacific region has induced the demand for semiconductors, especially in security, automation, solid-state lighting and transportation segments.
IMARC Group provides an analysis of the key trends in each segment of the Asia Pacific chip mounter market report, along with forecasts at the regional and country levels from 2025-2033. Our report has categorized the market based on technology and application.
Breakup by Technology:
Breakup by Application:
Breakup by Country:
The competitive landscape of the industry has also been examined along with the profiles of the key players.
Report Features | Details |
---|---|
Base Year of the Analysis | 2024 |
Historical Period | 2019-2024 |
Forecast Period | 2025-2033 |
Units | Billion USD |
Scope of the Report | Exploration of Historical and Forecast Trends, Industry Catalysts and Challenges, Segment-Wise Historical and Predictive Market Assessment:
|
Technologies Covered | Hole Technology, Surface Mount Technology, Fine Pitch Technology |
Applications Covered | Consumer Electronics, Medical, Automotive, Telecommunication, Others |
Countries Covered | China, Japan, India, South Korea, Australia, Indonesia, Others |
Customization Scope | 10% Free Customization |
Post-Sale Analyst Support | 10-12 Weeks |
Delivery Format | PDF and Excel through Email (We can also provide the editable version of the report in PPT/Word format on special request) |
Key Questions Answered in This Report: