The latest report by IMARC Group, titled “Copper Foil Market Report by Product Type (Rolled Copper Foil, Electrodeposited Copper Foil), Application (Printed Circuit Boards, Batteries, Electromagnetic Shielding, and Others), End Use Industry (Aerospace and Defense, Automotive, Building and Construction, Electrical and Electronics, Industrial Equipment, Medical, and Others), and Region 2025-2033,” finds that the global copper foil market reached a value of USD 6.4 Billion in 2024. Copper foil is a thin sheet produced by the deposition of copper particles from a solution onto a rotating titanium drum. It is obtained by electrodeposition, which allows the copper to be formed into extremely thin sheets. Copper foil is usually utilized in printed circuit boards (PCBs) to be installed in telecommunications equipment such as PCs and mobile phones. It also finds application as a substrate for coating anode materials in Li-ion batteries. Copper foils provide high electric conductivity and are also ductile and malleable. The material is increasingly used in stained glass, EMI/RFI shielding, arts and craft, motors, labels, batteries, plasma displays, and electronics.
Global Copper Foil Market Trends:
The market is primarily driven by the rising demand for mobile devices, laptops, tablets, and computers that utilize the internet. The availability of cheap data plans, increased bandwidth and improved 5G infrastructure is also fueling the market growth. Factors such as rapid urbanization are increasing the need for electronics, including washing machines, ovens and refrigerators, that are lightweight and offer advanced functions. Besides this, governments across various countries are extensively investing in decreasing greenhouse gas (GHG) emissions from internal combustion engines (ICE), which has increased the popularity of electric vehicles (EVs) among consumers. This has led to increased utilization of high-end copper foils for lithium-ion batteries. Besides this, copper foils are widely used in decorative materials, such as gold signs, tile mosaic, and handicrafts, which is propelling the market growth. Furthermore, several leading players are focusing on product differentiation by improving the surface properties of the copper foil, developing new surface treatment coatings, and achieving smaller thickness and weight for numerous applications, thereby creating a positive outlook for the market. Looking forward, the market is expected to reach a value of USD 10.8 Billion by 2033, exhibiting a CAGR of 5.9% during the forecast period (2025-2033).
Market Summary:
Report Features | Details |
---|---|
Base Year of the Analysis | 2024 |
Historical Period | 2019-2024 |
Forecast Period | 2025-2033 |
Units | Billion USD |
Segment Coverage | Product Type, Application, End Use Industry, Region |
Region Covered | Asia Pacific, Europe, North America, Latin America, Middle East and Africa |
Countries Covered | United States, Canada, Germany, France, United Kingdom, Italy, Spain, Russia, China, Japan, India, South Korea, Australia, Indonesia, Brazil, Mexico |
Companies Covered | Carl Schlenk AG, Chang Chun Group, Furukawa Electric Co. Ltd., ILJIN Materials Co. Ltd., JX Nippon Mining & Metals Corporation (ENEOS Holdings Inc.), LS Mtron Co. Ltd., Mitsui Mining & Smelting Co. Ltd., Nippon Denkai Ltd., Rogers Corporation, SKC Co. Ltd., Sumitomo Metal Mining Co. Ltd., Targray Technology International Inc. and UACJ Corporation. |
Customization Scope | 10% Free Customization |
Post-Sale Analyst Support | 10-12 Weeks |
Delivery Format | PDF and Excel through Email (We can also provide the editable version of the report in PPT/Word format on special request) |
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